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 SFP50N06
Silicon N-Channel MOSFET
Features
RDS(on)(Max 22m)@VGS=10V Ultra-low Gate Charge(Typical 31nC) Fast Switching Capability 100%Avalanche Tested Maximum Junction Temperature Range(150)
General Description
This Power MOSFET is produced using Winsemi's trench Layout -based process .This technology mproves the performances Compared with standard parts form various sources.All of these power MOSFETs are designed for applications in switching regulators , switching convertors, motor and relay drivers ,and drivers for high power bipolar switching transistors demanding
high speed and low gate drive power.
Absolute Maximum Ratings
Symbol
VDSS ID Continuous Drain Current(@Tc=100) IDM VGS EAS EAR dv/dt PD Derating Factor above 25 TJ,Tstg TL Junction and Storage Temperature Channel Temperature 1.3 -55~150 300 W/ Drain Current Pulsed Gate to Source Voltage Single Pulsed Avalanche Energy Repetitive Avalanche Energy Peak Diode Recovery dv /dt Total Power Dissipation(@Tc=25) (Note2) (Note1) (Note3) (Note1) 38 200 25 480 13 5.8 130 A A V mJ mJ V/ ns W Drain Source Voltage Continuous Drain Current(@Tc=25)
Parameter
Value
60 50
Units
V A
Thermal Characteristics
Symbol
RQJC RQCS RQJA
Parameter
Thermal Resistance , Junction -to -Case Case-to-Sink,Flat, Greased Surface Thermal Resistance , Junction-to -Ambient
Value Min
-
Typ
0.5 -
Max
0.96 62.5
Units
/W /W /W
Rev.A Aug.2010
Copyright@WinSemi Semiconductor Co., Ltd., All right reserved.
SFP50N06
Electrical Characteristics(Tc=25)
Characteristics
Gate leakage current Gate-source breakdown voltage
Symbol
IGSS V(BR)GSS
Test Condition
VGS=20V,VDS=0V IG=10 A,VDS=0V VDS=60V,VGS=0V
Min
20 60 2 -
Type
20 22 1180 440 65 15 105 60 65 31 8 13
Max
100 1 250 4 22 1540 580 90 40 220
Unit
nA V A A V V m S
Drain cut -off current
IDSS VDS=60V,Tc=125
Drain -source breakdown voltage Gate threshold voltage Drain -source ON resistance Forward Transconductance Input capacitance Reverse transfer capacitance Output capacitance Rise time Turn-on time Switching time Fall time Turn-off time Total gate charge(gate-source
V(BR)DSS VGS(th) RDS(ON) gfs Ciss Crss Coss tr ton tf toff Qg
ID=250 A,VGS=0V VDS=10V,ID=250 A VGS=10V,ID=25A VDS=25V,ID=25A VDS=25V, VGS=0V, f=1MHz VDD=30V, ID=25A RG=25 VGS=10V VDD=48V, (Note4,5)
pF
ns 130 140 41 nC -
-
plus gate-drain) Gate-source charge Gate-drain("miller") Charge Qgs Qgd
VGS=10V, ID=50A (Note4,5) -
Source-Drain Ratings and Characteristics(Ta=25)
Characteristics
Continuous drain reverse current Pulse drain reverse current Forward voltage(diode) Reverse recovery time Reverse recovery charge
Symbol
IDR IDRP VDSF trr Qrr
Test Condition
IDR=50A,VGS=0V IDR=50A,VGS=0V, dIDR / dt =100 A / s
Min
-
Type
52 75
Max
50 200 1.5 -
Unit
A A V ns C
Note 1.Repeativity rating :pulse width limited by junction temperature 2.L=0.5mH IAS=50A,VDD=25V,VGS=10V ,Starting TJ=25 3.ISD50A,di/dt380A/us,VDD2/7
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SFP50N06
Fig.1 Transfer characteristics
Fig.2 On -state Characteristics
Fig.3 Typical Capacitance vs Drain Current
Fig.4 On -resistance Variation vs Drain current and gate Voltage
Fig.5 On- resistance variation vs Junction Temperature
Fig.6 Gate charge Characteristics 3/7
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SFP50N06
Fig.7 Maximum Safe Operation Area
Fig.8 Maximum Drain current vs Case Temperature
Fig.9 Transient Thermal Response Curve
4/7
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SFP50N06
Fig.10 Gate Test circuit & Waveform
Fig.11 Resistive Switching Test Circuit & Waveform
Fig.12 Uncamped Inductive Switching Test Circuit & Waveform
5/7
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SFP50N06
Fig.13 Peak Diode Recovery dv/dt Test Circuit & Waveform
6/7
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SFP50N06
TO-220 Package Dimension
Unit:mm
7/7
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